Start Counter Electronics Geometry

On March 12, 2012, with Chuck Hutton, Fernando Barbosa, Tim Whitlatch, Mark Ito.

• 10 boards
• 1 mm air gap on BCAL
• Fernando will send specs for cable to Chuck
• no show stoppers identified
• Werner will need to weigh in on noise, room temperature current design
• patch panel idea from Fernando
• pre-amp separate drivers
∘ buffer for adc
∘ times 10 amplifier for tdc
• Chuck will send VXF[?] file to Fernando with current dimensions of board
• maybe go for final configuration in prototype
• 100 vs. 50 micron
• better rate capatility with 50
• better pde with 100
• order both for prototype


Talking with Carl Zorn about SiPM’s

  • talked to Carl Zorn
  • different arrangements are possible from Hamamatsu
  • different chassis are also possible, e. g., three-sides buttable, other than the ceramic
  • first device that they played around with was mounting individual 3mm x 3mm sensors on a custom board
  • mounting was done here, the guy who did it now has his own company
  • mounting not a huge deal, not for amateurs, but not beyond normal surface mount technology
  • custom arrangement possible but likely expensive for small quantities
  • mounting sensors on custom board may be cheap
  • recommends call Hamamatsu and discussing needs with them
    • sales: Samir Patel
    • engineer: Earl Hergert
  • Carl will send presentation that shows variety of products

Talking to Carl about SiPM’s

Spoke with Carl Zorn on 12/21/2010.

On using high temperature as a proxy for radiation damage:

  • elevated temperature a fine stand-in for radiation damage
  • factor of 2 for 10 C rise in temperature
  • might have to increase the bias voltage to increase the breakdown voltage[?]

On sending another device:

  • he will look for another device to send Werner
  • perhaps an irradiated one can be sent
  • about 80 are due in March